METHOD FOR PRODUCING INTERCONNECT STRUCTURES FOR INTEGRATED CIRCUITS

PROBLEM TO BE SOLVED: To provide a method for producing a semiconductor device which removes the overburden of barrier and conductive material using chemical mechanical polishing (CMP), thereby creating a larger process window to compensate for non-uniformity in deposition. SOLUTION: The method for...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	VAES JAN, HUYGHEBAERT CEDRIC, VAN OLMEN JAN
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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