SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

PROBLEM TO BE SOLVED: To provide a technique for improving data holding characteristics of a MRAM device by improving resistance to an external magnetic field in a semiconductor device including the MRAM device. SOLUTION: A magnetic shielding member PM1 is arranged on a die pad DP through a die atta...

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Bibliographische Detailangaben
Hauptverfasser:	YAMAZAKI AKIRA, MISUMI KAZUYUKI, AKIYAMA TATSUHIKO, IZUMI TADAO, BANDO KOJI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a technique for improving data holding characteristics of a MRAM device by improving resistance to an external magnetic field in a semiconductor device including the MRAM device. SOLUTION: A magnetic shielding member PM1 is arranged on a die pad DP through a die attach film DAF1. A semiconductor chip CHP is mounted on the magnetic shielding member PM1 through a die attach film DAF2. The magnetic shielding member PM2 is arranged on the semiconductor chip CHP through a die attach film DAF3. In other words, the semiconductor chip CHP is sandwiched between the magnetic shielding member PM1 and the magnetic shielding member PM2. In this case, planar area of the magnetic shielding member PM2 is smaller than that of the magnetic shielding member PM1, but the thickness of the magnetic shielding member PM2 is thicker than that of the magnetic shielding member PM1. COPYRIGHT: (C)2010,JPO&INPIT