INSTRUMENT

PROBLEM TO BE SOLVED: To provide a panel instrument capable of reducing size while securing the degree of freedom of mounting of a printed board. SOLUTION: This instrument includes: a case; a front cover formed into a nearly-U-shaped form by a front surface and arm parts, inserted into the case, and...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	ANDO HIKARI, KAWACHI KAZUHIKO
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a panel instrument capable of reducing size while securing the degree of freedom of mounting of a printed board. SOLUTION: This instrument includes: a case; a front cover formed into a nearly-U-shaped form by a front surface and arm parts, inserted into the case, and having at least one nearly-columnar holding member formed on the back face thereof; a main board attached to the back face of the front cover and having a through-hole through which the holding member penetrates; and a first printed board held by the arm parts and the holding member of the front cover. COPYRIGHT: (C)2010,JPO&INPIT