WIRING SUBSTRATE AND MANUFACTURING METHOD FOR THE SAME

PROBLEM TO BE SOLVED: To provide a wiring substrate that properly prevents bulging in a conductive film and pinholes in the conductive film, without having to provide inclination or unevenness on the surface of the conductive film, in a wiring substrate having the conductive film. SOLUTION: The wiring substrate 1 has a conductive film 10, formed by successively laminating a base layer 11 made of a conductor, copper layers 12, 13 made of copper, and a gold layer 14 made of gold on its surface; the copper layers 12, 13 are formed, by successively forming a first layer 12 made of copper plating and a second layer 13 made of copper plating from the side of the base layer 11. Each gas-venting passage 15 for venting the gas generated between the base layer 11 and the first layer 12 is formed inside the first layer 12, from the face on the side of the base layer 11 to the face on the side of the second layer 13 in the first layer 12, and each gas-venting passage 15 is closed by the second layer 13 on the face on the side of the second layer 13 in the first layer 12. COPYRIGHT: (C)2010,JPO&INPIT