SUBSTRATE FIXING DEVICE

PROBLEM TO BE SOLVED: To provide a substrate fixing device which is suitable to be used at high temperature. SOLUTION: The substrate fixing device has an electrostatic chuck for attracting and holding an object of attraction placed on one surface of a base, and a base plate for supporting the electr...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: YONEKURA HIROSHI, KAWAI JIRO
Format: Patent
Sprache:eng
Schlagworte:
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Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To provide a substrate fixing device which is suitable to be used at high temperature. SOLUTION: The substrate fixing device has an electrostatic chuck for attracting and holding an object of attraction placed on one surface of a base, and a base plate for supporting the electrostatic chuck, the base and base plate being fixed through only a first columnar member. COPYRIGHT: (C)2010,JPO&INPIT