VAPOR REFLOW SOLDERING DEVICE

PROBLEM TO BE SOLVED: To provide a soldering device capable of preventing a flow-out of a heating medium effectively. SOLUTION: The soldering device 1 includes a steam vessel 2, a liquid heating medium 3 stored in the lower part of the steam vessel 2, a heating part 4 for generating steam by heating...

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Bibliographische Detailangaben
1. Verfasser:	YOSHIMOTO HIRONORI
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACHINE TOOLS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS PRINTED CIRCUITS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a soldering device capable of preventing a flow-out of a heating medium effectively. SOLUTION: The soldering device 1 includes a steam vessel 2, a liquid heating medium 3 stored in the lower part of the steam vessel 2, a heating part 4 for generating steam by heating the heating medium 3, and a carry-in part 5 for carrying a work from a carry-in opening of the steam vessel 2 into the steam vessel 2. A heating medium-recovery part 20 is mounted so as to close the carry-in opening 7. The heating medium-recovery part 20 can be inserted in and taken out from the carry-in opening 7 of the steam vessel 2. COPYRIGHT: (C)2010,JPO&INPIT