SHRINK PACKAGE ON BOARD

SHRINK PACKAGE ON BOARD

PROBLEM TO BE SOLVED: To provide a package allowing the inspection of the package to be easily carried out when the package is mounted on a board. SOLUTION: A method of forming a device includes a step of providing a printed circuit board substrate 120 having a die attaching region on a first surfac...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: MANALAC RODEL, TENG ENG KIAN, GAN RICHARD TE, PARK TECK WAH
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To provide a package allowing the inspection of the package to be easily carried out when the package is mounted on a board. SOLUTION: A method of forming a device includes a step of providing a printed circuit board substrate 120 having a die attaching region on a first surface of thereof. The method also includes a step of attaching a die 110 to the die attaching region 128. The die is electrically connected to first land pads 138 disposed around the die attachment region on the first surface. A cap is formed in a target area by a top gate process to produce the cap 184 with an even surface. The cap covers the die and leaves at least the first land pads exposed. COPYRIGHT: (C)2010,JPO&INPIT