STRUCTURE AND METHOD FOR RADIATING HEAT OF ELEMENT

PROBLEM TO BE SOLVED: To provide a structure and method for radiating heat of an element for improving heat radiation performance for suppressing temperature rise of the element. SOLUTION: This structure for radiating heat of an element includes: an element 1 mounted on a board 3 and arranged to exp...

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1. Verfasser:	KOZU TADAO
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a structure and method for radiating heat of an element for improving heat radiation performance for suppressing temperature rise of the element. SOLUTION: This structure for radiating heat of an element includes: an element 1 mounted on a board 3 and arranged to expose an element heat radiation part 12 to a surface on the board side; the board 3 where a through-hole 32 penetrating a mounting surface and the back side of the mounting surface is formed to expose the element heat radiation part 12 of the element 1 to the back side of the mounting surface; and a radiator 4 provided with a projecting part 43 coming into surface contact with the element heat radiation part 12 of the element 1 through a heat transfer material 2 by penetrating the through-hole 32, and provided with heat radiation fins 42 for increasing a heat radiation area. COPYRIGHT: (C)2010,JPO&INPIT