CONNECTION STRUCTURE AND CONNECTION METHOD OF PRINTED CIRCUIT BOARD

CONNECTION STRUCTURE AND CONNECTION METHOD OF PRINTED CIRCUIT BOARD

PROBLEM TO BE SOLVED: To provide a connection structure and a connection method of a first printed circuit board, an electronic component, and a second printed circuit board in a manufacturing cost reduced by a simple manufacturing process. SOLUTION: To wiring electrodes 4 of a wiring board 1, metal...

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Hauptverfasser: NAKATSUGI KYOICHIRO, YAMAMOTO MASAMICHI
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Sprache:eng
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CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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creator NAKATSUGI KYOICHIRO
YAMAMOTO MASAMICHI
description PROBLEM TO BE SOLVED: To provide a connection structure and a connection method of a first printed circuit board, an electronic component, and a second printed circuit board in a manufacturing cost reduced by a simple manufacturing process. SOLUTION: To wiring electrodes 4 of a wiring board 1, metal electrodes 5 of a flexible printed circuit board 3 are connected via an electrode connecting adhesive 2. On the wiring electrodes 4 and the metal electrodes 5, oxidation preventing films 4a and 5a, which are organic films for preventing oxidation, are respectively formed on the surfaces of the wiring electrodes 4 and the metal electrodes 5. The oxidation preventing films 4a and 5a have a thickness T of 0.05 μm or more and 0.5 μm or less. COPYRIGHT: (C)2010,JPO&INPIT
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fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_JP2010141265A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>JP2010141265A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_JP2010141265A3</originalsourceid><addsrcrecordid>eNrjZHB29vfzc3UO8fT3UwgOCQp1DgkNclVw9HNRQJLwdQ3x8HdR8HdTCAjy9AtxBUp6BjmHeoYoOPk7BrnwMLCmJeYUp_JCaW4GJTfXEGcP3dSC_PjU4oLE5NS81JJ4rwAjA0MDQxNDIzNTR2OiFAEAldQr9Q</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>CONNECTION STRUCTURE AND CONNECTION METHOD OF PRINTED CIRCUIT BOARD</title><source>esp@cenet</source><creator>NAKATSUGI KYOICHIRO ; YAMAMOTO MASAMICHI</creator><creatorcontrib>NAKATSUGI KYOICHIRO ; YAMAMOTO MASAMICHI</creatorcontrib><description>PROBLEM TO BE SOLVED: To provide a connection structure and a connection method of a first printed circuit board, an electronic component, and a second printed circuit board in a manufacturing cost reduced by a simple manufacturing process. SOLUTION: To wiring electrodes 4 of a wiring board 1, metal electrodes 5 of a flexible printed circuit board 3 are connected via an electrode connecting adhesive 2. On the wiring electrodes 4 and the metal electrodes 5, oxidation preventing films 4a and 5a, which are organic films for preventing oxidation, are respectively formed on the surfaces of the wiring electrodes 4 and the metal electrodes 5. The oxidation preventing films 4a and 5a have a thickness T of 0.05 μm or more and 0.5 μm or less. COPYRIGHT: (C)2010,JPO&amp;INPIT</description><language>eng</language><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS</subject><creationdate>2010</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20100624&amp;DB=EPODOC&amp;CC=JP&amp;NR=2010141265A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76516</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20100624&amp;DB=EPODOC&amp;CC=JP&amp;NR=2010141265A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>NAKATSUGI KYOICHIRO</creatorcontrib><creatorcontrib>YAMAMOTO MASAMICHI</creatorcontrib><title>CONNECTION STRUCTURE AND CONNECTION METHOD OF PRINTED CIRCUIT BOARD</title><description>PROBLEM TO BE SOLVED: To provide a connection structure and a connection method of a first printed circuit board, an electronic component, and a second printed circuit board in a manufacturing cost reduced by a simple manufacturing process. SOLUTION: To wiring electrodes 4 of a wiring board 1, metal electrodes 5 of a flexible printed circuit board 3 are connected via an electrode connecting adhesive 2. On the wiring electrodes 4 and the metal electrodes 5, oxidation preventing films 4a and 5a, which are organic films for preventing oxidation, are respectively formed on the surfaces of the wiring electrodes 4 and the metal electrodes 5. The oxidation preventing films 4a and 5a have a thickness T of 0.05 μm or more and 0.5 μm or less. COPYRIGHT: (C)2010,JPO&amp;INPIT</description><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2010</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZHB29vfzc3UO8fT3UwgOCQp1DgkNclVw9HNRQJLwdQ3x8HdR8HdTCAjy9AtxBUp6BjmHeoYoOPk7BrnwMLCmJeYUp_JCaW4GJTfXEGcP3dSC_PjU4oLE5NS81JJ4rwAjA0MDQxNDIzNTR2OiFAEAldQr9Q</recordid><startdate>20100624</startdate><enddate>20100624</enddate><creator>NAKATSUGI KYOICHIRO</creator><creator>YAMAMOTO MASAMICHI</creator><scope>EVB</scope></search><sort><creationdate>20100624</creationdate><title>CONNECTION STRUCTURE AND CONNECTION METHOD OF PRINTED CIRCUIT BOARD</title><author>NAKATSUGI KYOICHIRO ; YAMAMOTO MASAMICHI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2010141265A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2010</creationdate><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><toplevel>online_resources</toplevel><creatorcontrib>NAKATSUGI KYOICHIRO</creatorcontrib><creatorcontrib>YAMAMOTO MASAMICHI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>NAKATSUGI KYOICHIRO</au><au>YAMAMOTO MASAMICHI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>CONNECTION STRUCTURE AND CONNECTION METHOD OF PRINTED CIRCUIT BOARD</title><date>2010-06-24</date><risdate>2010</risdate><abstract>PROBLEM TO BE SOLVED: To provide a connection structure and a connection method of a first printed circuit board, an electronic component, and a second printed circuit board in a manufacturing cost reduced by a simple manufacturing process. SOLUTION: To wiring electrodes 4 of a wiring board 1, metal electrodes 5 of a flexible printed circuit board 3 are connected via an electrode connecting adhesive 2. On the wiring electrodes 4 and the metal electrodes 5, oxidation preventing films 4a and 5a, which are organic films for preventing oxidation, are respectively formed on the surfaces of the wiring electrodes 4 and the metal electrodes 5. The oxidation preventing films 4a and 5a have a thickness T of 0.05 μm or more and 0.5 μm or less. COPYRIGHT: (C)2010,JPO&amp;INPIT</abstract><oa>free_for_read</oa></addata></record>
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subjects CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
title CONNECTION STRUCTURE AND CONNECTION METHOD OF PRINTED CIRCUIT BOARD
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-02-15T09%3A34%3A00IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=NAKATSUGI%20KYOICHIRO&rft.date=2010-06-24&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EJP2010141265A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true