CONNECTION STRUCTURE AND CONNECTION METHOD OF PRINTED CIRCUIT BOARD

PROBLEM TO BE SOLVED: To provide a connection structure and a connection method of a first printed circuit board, an electronic component, and a second printed circuit board in a manufacturing cost reduced by a simple manufacturing process. SOLUTION: To wiring electrodes 4 of a wiring board 1, metal...

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Bibliographische Detailangaben
Hauptverfasser: NAKATSUGI KYOICHIRO, YAMAMOTO MASAMICHI
Format: Patent
Sprache:eng
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Zusammenfassung:PROBLEM TO BE SOLVED: To provide a connection structure and a connection method of a first printed circuit board, an electronic component, and a second printed circuit board in a manufacturing cost reduced by a simple manufacturing process. SOLUTION: To wiring electrodes 4 of a wiring board 1, metal electrodes 5 of a flexible printed circuit board 3 are connected via an electrode connecting adhesive 2. On the wiring electrodes 4 and the metal electrodes 5, oxidation preventing films 4a and 5a, which are organic films for preventing oxidation, are respectively formed on the surfaces of the wiring electrodes 4 and the metal electrodes 5. The oxidation preventing films 4a and 5a have a thickness T of 0.05 μm or more and 0.5 μm or less. COPYRIGHT: (C)2010,JPO&INPIT