JOINT STRUCTURE

PROBLEM TO BE SOLVED: To provide a joint structure having suitable mechanical reliability, wherein a covered copper wire is thermally caulked and joined to a copper terminal. SOLUTION: The joint structure includes the covered rod copper wire 1 to be heated and melted, and the plate-like copper termi...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: TSURUTA AKIZO, OTSUKA HISASHI, KATO TORU, BABA TAKENORI, ITO TADASHI
Format: Patent
Sprache:eng
Schlagworte:
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