JOINT STRUCTURE

PROBLEM TO BE SOLVED: To provide a joint structure having suitable mechanical reliability, wherein a covered copper wire is thermally caulked and joined to a copper terminal. SOLUTION: The joint structure includes the covered rod copper wire 1 to be heated and melted, and the plate-like copper termi...

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Bibliographische Detailangaben
Hauptverfasser: TSURUTA AKIZO, OTSUKA HISASHI, KATO TORU, BABA TAKENORI, ITO TADASHI
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To provide a joint structure having suitable mechanical reliability, wherein a covered copper wire is thermally caulked and joined to a copper terminal. SOLUTION: The joint structure includes the covered rod copper wire 1 to be heated and melted, and the plate-like copper terminal 2 subjected to tin plating and adapted to be thermally caulked while being rolled around the copper wire 1. An integrated value that a tin composition ratio on the interface of a joint between the copper wire 1 and the copper terminal 2 is integrated over a distance in the direction perpendicular to the interface is 0.25-4.95 atom% micrometer. COPYRIGHT: (C)2010,JPO&INPIT