NOZZLE, AND APPARATUS AND METHOD FOR PROCESSING SUBSTRATE USING SAME

PROBLEM TO BE SOLVED: To provide a nozzle for executing a development process by supplying a developer to a surface of a substrate with resist applied thereto and subjected to an exposure process; and an apparatus and method for processing a substrate using the same. SOLUTION: This apparatus for pro...

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Bibliographische Detailangaben
Hauptverfasser: PARK SANG UK, GO JAE SEUNG, PARK SUNG-WOON
Format: Patent
Sprache:eng
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Zusammenfassung:PROBLEM TO BE SOLVED: To provide a nozzle for executing a development process by supplying a developer to a surface of a substrate with resist applied thereto and subjected to an exposure process; and an apparatus and method for processing a substrate using the same. SOLUTION: This apparatus for processing a substrate includes a substrate supporting member including a spin head on which a substrate is placed, a nozzle discharging processing liquid to the substrate placed on the spin head, and a processing liquid supplying source supplying the processing liquid to the nozzle. The nozzle includes a plurality of discrete discharging openings each having a slit-shaped cross section and arranged in series in one direction, and an integration discharging opening of a single slit shape to which the plurality of discrete discharging openings are connected. COPYRIGHT: (C)2010,JPO&INPIT