HIGH DENSITY POLYETHYLENE RESIN COMPOSITION FOR FILM

PROBLEM TO BE SOLVED: To provide a high density polyethylene resin composition eliminating the occurrence of powdering and gum in a film forming process and providing a film having excellent scratch resistance and hardly scratching a material to be packaged. SOLUTION: The high density polyethylene r...

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Bibliographische Detailangaben
Hauptverfasser:	MIWA SHINJI, KAMIYA TATSUYUKI
Format:	Patent
Sprache:	eng
Schlagworte:	AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS GENERAL PROCESSES OF COMPOUNDING METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS WORKING-UP
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a high density polyethylene resin composition eliminating the occurrence of powdering and gum in a film forming process and providing a film having excellent scratch resistance and hardly scratching a material to be packaged. SOLUTION: The high density polyethylene resin composition for the film contains 100 pts.wt. high density polyethylene having 0.940-0.980 g/cm3density, 0.01-10 g/10 min MFR (Melt Flow Rate) (190°C 21.18 N) and Q value of 4-40 and 0.05-1 pt.wt. talc in which the sum of the volume of particles having ≥20 μm particle diameter is 5% or less of the total volume of the total particles. COPYRIGHT: (C)2010,JPO&INPIT