MOLDING MATERIAL, MOLDED ARTICLE, CASING FOR USE IN ELECTRONIC APPLIANCE, AND METHOD FOR MANUFACTURING MOLDED ARTICLE

PROBLEM TO BE SOLVED: To provide a molding material which is high in the heat deformation temperature, is excellent in physical properties such as elastic modulus, and does not easily discolored during molding. SOLUTION: This molding material comprises a composition including (1) a thermoplastic cel...

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1. Verfasser: TAKAMOTO TETSUFUMI
Format: Patent
Sprache:eng
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Zusammenfassung:PROBLEM TO BE SOLVED: To provide a molding material which is high in the heat deformation temperature, is excellent in physical properties such as elastic modulus, and does not easily discolored during molding. SOLUTION: This molding material comprises a composition including (1) a thermoplastic cellulose derivative and (2) a crystalline cellulose which has a purity of at least 90% or more and which is chemically modified. COPYRIGHT: (C)2010,JPO&INPIT