METHOD FOR REPAIRING STRUCTURE

PROBLEM TO BE SOLVED: To provide a repair method which enables a through-hole to be surely and rapidly repaired only by work from the one side of a wall of a structure, when the through-hole penetrating the one side of the wall and the other side thereof is repaired. SOLUTION: In the method for repa...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: OISHI AKITSUGU, ODANO NAOMITSU, TORII KAZUYOSHI, KIMURA HIROSHI
Format: Patent
Sprache:eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To provide a repair method which enables a through-hole to be surely and rapidly repaired only by work from the one side of a wall of a structure, when the through-hole penetrating the one side of the wall and the other side thereof is repaired. SOLUTION: In the method for repairing the first structure, a filler 20 is infilled into a bag body 10 after the bag body 10 is inserted into a through-hole 4A from a one-side opening 6A of the through-hole 4A; and the through-hole 4A is closed by closing a mouth portion 11 of the bag body 10 after the completion of the filling of the filler 20. Additionally, in the method for repairing the second structure, a filler storage bag 30, in which the filler 20 is infilled into the bag body 10, is inserted into the through-hole 4A from the one-side opening 6A of the through-hole 4A, so as to close the through-hole 4A. COPYRIGHT: (C)2010,JPO&INPIT