SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To provide a semiconductor device and a method for manufacturing the semiconductor device which can suppress a contact between adjacent solder bumps in the semiconductor device adopting the solder bump. SOLUTION: The semiconductor device includes: a semiconductor chip 120 havin...

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Hauptverfasser:	IZUMI TADAO, TAKADA YASUNORI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a semiconductor device and a method for manufacturing the semiconductor device which can suppress a contact between adjacent solder bumps in the semiconductor device adopting the solder bump. SOLUTION: The semiconductor device includes: a semiconductor chip 120 having a first main surface; a plurality of electrodes 123 formed on the first main surface; a plurality of land parts 127 formed for each electrode 123; a package substrate 160 having a second main surface opposite to the first main surface of the semiconductor chip 120; a plurality of electrodes 162 formed on the second main surface; a land part 170 formed in the electrode 162; and a solder bump 125 for connecting the land part 127 to the land part 170. COPYRIGHT: (C)2010,JPO&INPIT