AQUEOUS DISPERSING ELEMENT FOR CHEMICAL MECHANICAL POLISHING, METHOD OF PREPARING DISPERSING ELEMENT, AND METHOD OF PERFORMING CHEMICAL MECHANICAL POLISHING OF SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To provide an aqueous dispersing element for chemical mechanical polishing capable of performing polishing without any copper remainder (copper residue) and corrosion while striking a balance between high polishing speed and highly flat characteristics without causing any defec...

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Bibliographische Detailangaben
Hauptverfasser:	TAI YUGO, NISHIGUCHI NAOKI, BABA ATSUSHI, KONNO TOMOHISA, KUBOTA KIYONOBU
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVES BASIC ELECTRIC ELEMENTS CHEMISTRY DRESSING OR CONDITIONING OF ABRADING SURFACES DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS PAINTS PERFORMING OPERATIONS POLISHES POLISHING SEMICONDUCTOR DEVICES TRANSPORTING
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