MEMS SENSOR AND MANUFACTURING METHOD THEREFOR

PROBLEM TO BE SOLVED: To provide a MEMS sensor improved especially in a space structure between a sensor part and a second substrate (support substrate). SOLUTION: The MEMS sensor includes: a first substrate 1; the second substrate 2; and an insulating layer 3 interposed between the first substrate...

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Bibliographische Detailangaben
Hauptverfasser:	KOBAYASHI KIYOSHI, MIYATAKE TORU
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT MEASURING MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION,OR SHOCK MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICALDEVICES MICROSTRUCTURAL TECHNOLOGY PERFORMING OPERATIONS PHYSICS PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTUREOR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS SEMICONDUCTOR DEVICES TESTING TRANSPORTING
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a MEMS sensor improved especially in a space structure between a sensor part and a second substrate (support substrate). SOLUTION: The MEMS sensor includes: a first substrate 1; the second substrate 2; and an insulating layer 3 interposed between the first substrate 1 and the second substrate 2. The sensor part 4 equipped with a movable electrode section and a fixed electrode section, and respective anchor portions 12, 14, 17 and 19 of the movable electrode and the fixed electrode section, are formed on the first substrate 1. The above anchor portions are supported so as to be fixed to the surface of the second substrate 2 through the insulating layer 3. A recessed part 5 is formed on the surface of the second substrate 2 facing the sensor part 4, thereby forming a space between the sensor part 4 and the second substrate 2. COPYRIGHT: (C)2010,JPO&INPIT