EXPOSURE MASK, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
PROBLEM TO BE SOLVED: To provide an exposure mask with which a fine pattern can be formed with high accuracy by double patterning by use of a single exposure mask and misalignment can be detected, and to provide a method for manufacturing a semiconductor device. SOLUTION: The exposure mask includes...
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creator | TANAKA YOSHIJI |
description | PROBLEM TO BE SOLVED: To provide an exposure mask with which a fine pattern can be formed with high accuracy by double patterning by use of a single exposure mask and misalignment can be detected, and to provide a method for manufacturing a semiconductor device. SOLUTION: The exposure mask includes a plurality of blocks each having a pattern formed therein, arranged at least in one direction at a predetermined block interval, in which the pattern is prepared by repeatedly forming the same pattern at a predetermined pitch. The mask also includes a first alignment inspection mark and a second alignment inspection mark disposed at a position shifted from the first alignment inspection mark along the arrangement direction of the blocks, by a distance in accordance with the distance equal to a single interval of the blocks. COPYRIGHT: (C)2010,JPO&INPIT |
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SOLUTION: The exposure mask includes a plurality of blocks each having a pattern formed therein, arranged at least in one direction at a predetermined block interval, in which the pattern is prepared by repeatedly forming the same pattern at a predetermined pitch. The mask also includes a first alignment inspection mark and a second alignment inspection mark disposed at a position shifted from the first alignment inspection mark along the arrangement direction of the blocks, by a distance in accordance with the distance equal to a single interval of the blocks. 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SOLUTION: The exposure mask includes a plurality of blocks each having a pattern formed therein, arranged at least in one direction at a predetermined block interval, in which the pattern is prepared by repeatedly forming the same pattern at a predetermined pitch. The mask also includes a first alignment inspection mark and a second alignment inspection mark disposed at a position shifted from the first alignment inspection mark along the arrangement direction of the blocks, by a distance in accordance with the distance equal to a single interval of the blocks. 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subjects | APPARATUS SPECIALLY ADAPTED THEREFOR BASIC ELECTRIC ELEMENTS CINEMATOGRAPHY ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY HOLOGRAPHY MATERIALS THEREFOR ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS SEMICONDUCTOR DEVICES |
title | EXPOSURE MASK, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE |
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