ELECTRONIC APPARATUS

PROBLEM TO BE SOLVED: To provide an electronic apparatus large in a heat-transfer area between a heat generation component and a metal housing (radiator), capable of reducing contact thermal resistance by increasing pressing force between the heat generation component and the housing in response to temperature rise in the metal housing by heat generation, and excelling in space efficiency in the apparatus. SOLUTION: This electronic apparatus includes: the metal housing 11 having a first wall part 11a, a second wall part 11b facing the first wall part 11a, and sidewall parts 11c, 11d connecting both edges of the first and second wall parts 11a, 11b to each other; the heat generation component 13 mounted on one surface of a rigid substrate 12, and having an upper surface abutting on the first wall part 11a, or facing the first wall part through a minute space; and a spacer 14 which is formed of a material having a coefficient of thermal expansion larger than those of the sidewall parts 11c, 11d of the metal housing 11, and of which the one side supports the rigid substrate 12 and the other side is supported by the second wall part 11b. COPYRIGHT: (C)2010,JPO&INPIT