SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To prevent a first semiconductor chip from colliding with a lead frame when a second semiconductor chip is mounted on the first semiconductor chip. SOLUTION: The lead frame includes a die pad, and suspension leads SL supporting the die pad. A junction part JP is formed on the l...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: YAMAZAKI AKIRA, HATAUCHI KAZUSHI, YAMASHITA KUNIHIRO, IZUMI TADAO
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To prevent a first semiconductor chip from colliding with a lead frame when a second semiconductor chip is mounted on the first semiconductor chip. SOLUTION: The lead frame includes a die pad, and suspension leads SL supporting the die pad. A junction part JP is formed on the lead frame. The first semiconductor chip C1 is arranged on the lead frame through the junction part JP. The second semiconductor chip C2 is arranged on the first semiconductor chip C1. A resin member covers the die pad and the first and second semiconductor chips C1, C2. The junction pad JP is located on each of the die pad and the suspension leads SL. COPYRIGHT: (C)2010,JPO&INPIT