FLOW SOLDERING METHOD

PROBLEM TO BE SOLVED: To solve a problem that it is impossible to refer to the conventional soldering achievements of the liquid flux having reduced amount of VOC or not using the same, because this liquid flux uses water that is not easier in evaporation than alcohol and cannot perfectly remove wat...

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Bibliographische Detailangaben
Hauptverfasser:	KISHI ARATA, NAKATANI MASAAKI, SUETSUGU KENICHIRO
Format:	Patent
Sprache:	eng
Schlagworte:	ALLOYS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY FERROUS OR NON-FERROUS ALLOYS MACHINE TOOLS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METAL-WORKING NOT OTHERWISE PROVIDED FOR METALLURGY PERFORMING OPERATIONS PRINTED CIRCUITS SOLDERING OR UNSOLDERING TRANSPORTING TREATMENT OF ALLOYS OR NON-FERROUS METALS WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To solve a problem that it is impossible to refer to the conventional soldering achievements of the liquid flux having reduced amount of VOC or not using the same, because this liquid flux uses water that is not easier in evaporation than alcohol and cannot perfectly remove water content before supply to an injection solder vessel under the existing pre-heating temperature of the flux. SOLUTION: In this flow soldering method, the soldering process is conducted within the injection solder vessel by loading an inserting component after low VOC soldering paste is printed by utilizing the low VOC (Volatile Organic Compounds) solder paste and setting a metal mask 5 having a shape of opening where the solder is not printed at the central area of a through-hole 2 in a through-hole land electrode of the soldering surface 4 of the substrate 1 for flow. COPYRIGHT: (C)2010,JPO&INPIT