CURABLE RESIN COMPOSITION

PROBLEM TO BE SOLVED: To provide a curable resin composition not only extremely excellent in adhesion with a base material and excellent in chemicals resistance, but also capable of obtaining a cured form having high hardness. SOLUTION: The curable resin composition comprises: a copolymer A containi...

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Hauptverfasser:	NIJUKKEN TOSHIHIKO, NAKAGAWA YASUNOBU
Format:	Patent
Sprache:	eng
Schlagworte:	CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a curable resin composition not only extremely excellent in adhesion with a base material and excellent in chemicals resistance, but also capable of obtaining a cured form having high hardness. SOLUTION: The curable resin composition comprises: a copolymer A containing at least a monomer unit represented by Formula (1) (where R1represents a hydrogen atom or a methyl group, R2represents a 1-8C divalent aliphatic saturated hydrocarbon group; and R3represents a residue of a blocking agent R3H for an isocyanate group), corresponding to a vinyl monomer (a) having a blocked isocyanate group, and a monomer unit corresponding to a vinyl monomer b having a 3- to 5-membered cyclic ether group; and a block polyisocyanate compound B. COPYRIGHT: (C)2010,JPO&INPIT