DIRECT DIE BONDING USING HEATED BOND HEAD

PROBLEM TO BE SOLVED: To provide a direct die bonding method for die bonding, which prevents a deficiency of a die bonding method of a conventional technology at least to some extent. SOLUTION: A method is provided for bonding a die comprising a solder layer of a melting point Tm. A bond head is hea...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	TU PING LIANG, LO KING MING, DING YING, LI MING, CHUNG KWOK KEE
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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