DIRECT DIE BONDING USING HEATED BOND HEAD

PROBLEM TO BE SOLVED: To provide a direct die bonding method for die bonding, which prevents a deficiency of a die bonding method of a conventional technology at least to some extent. SOLUTION: A method is provided for bonding a die comprising a solder layer of a melting point Tm. A bond head is heated to a bond head setting temperature T1, which is higher than Tm, and a substrate is heated to a substrate setting temperature T2, which is lower than Tm. Thereafter, the die is lifted by the bond head, and the die is heated towards temperature T1 to melt the solder layer. The solder layer of the die is pressed onto the substrate to bond the die to the substrate, and thereafter the die is separated from the bond head so that the solder layer is cooled towards T2 and solidifies. COPYRIGHT: (C)2010,JPO&INPIT