METHOD OF MANUFACTURING WIRING BOARD, AND WIRING BOARD

PROBLEM TO BE SOLVED: To set up a minute wiring pattern on an insulation board while having consistency with the formation process of an interlayer connector and the formation process of a conductive layer pattern requiring no fineness without increasing cost. SOLUTION: A lamination board of at least five layers is formed, in which a first conductive layer having a first conductor and a second conductor layer having a second conductor different from the first conductor are provided in a lamination fashion on first and second primary faces of an insulation board having the first primary face and the second primary face opposing the first primary face. The second conductor layer of the lamination plate is subjected to patterning to allow part of the first conductor layer to be exposed. A resist pattern is formed on part of the first conductor layer. A third conductor layer is formed on part of the first conductor layer where the resist pattern is removed with the resist pattern as a mask. The resist pattern is removed. The first conductor layer is removed with the second and the third conductor layers as the mask. COPYRIGHT: (C)2010,JPO&INPIT