SEMICONDUCTOR DEVICE FORMING SUBSTRATE WHICH IS INTERCONNECTED AND LASER BONDING METHOD OF THE SAME

SEMICONDUCTOR DEVICE FORMING SUBSTRATE WHICH IS INTERCONNECTED AND LASER BONDING METHOD OF THE SAME

PROBLEM TO BE SOLVED: To provide a semiconductor device forming substrate that ensures reliability of a bonding part of an electrode and a wiring member and which is interconnected, and to provide a laser bonding method of the substrate. SOLUTION: The semiconductor device forming substrate includes...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
1. Verfasser: YASUTAKE KENJI
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
CLADDING OR PLATING BY SOLDERING OR WELDING
CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MACHINE TOOLS
METAL-WORKING NOT OTHERWISE PROVIDED FOR
PERFORMING OPERATIONS
SEMICONDUCTOR DEVICES
SOLDERING OR UNSOLDERING
TRANSPORTING
WELDING
WORKING BY LASER BEAM
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To provide a semiconductor device forming substrate that ensures reliability of a bonding part of an electrode and a wiring member and which is interconnected, and to provide a laser bonding method of the substrate. SOLUTION: The semiconductor device forming substrate includes a substrate 5 on which a semiconductor device is formed, an electrode member 6 formed on the substrate 5, an insulating member 7 covering a surface except for the electrode member 6 on the substrate 5 and a wiring member 1 which is disposed above the insulating member 7, connects the electrode members 6 and includes a core material 2 and low melting point metal members 3 covering a periphery of the core material 2. COPYRIGHT: (C)2010,JPO&INPIT