METHOD OF MANUFACTURING ELECTRONIC DEVICE

PROBLEM TO BE SOLVED: To provide a method of manufacturing an electronic device, in which solder is disposed on a substrate, where wire bonding is carried out, using a strip mask, wherein residues of the strip mask being suitably reduced without plating a bonding land with Pd. SOLUTION: A reduction...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	NAKAMURA TOSHIHIRO, IMADA SHINJI, SAGAWA HARUHIDE, KASUGAI HIROSHI, OTANI YUJI, TERUI KENICHIRO
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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