METHOD OF MANUFACTURING ELECTRONIC DEVICE

PROBLEM TO BE SOLVED: To provide a method of manufacturing an electronic device, in which solder is disposed on a substrate, where wire bonding is carried out, using a strip mask, wherein residues of the strip mask being suitably reduced without plating a bonding land with Pd. SOLUTION: A reduction...

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Bibliographische Detailangaben
Hauptverfasser:	NAKAMURA TOSHIHIRO, IMADA SHINJI, SAGAWA HARUHIDE, KASUGAI HIROSHI, OTANI YUJI, TERUI KENICHIRO
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a method of manufacturing an electronic device, in which solder is disposed on a substrate, where wire bonding is carried out, using a strip mask, wherein residues of the strip mask being suitably reduced without plating a bonding land with Pd. SOLUTION: A reduction member 110, which is easier to oxidize than base metal 12a of the bonding land 12 at curing temperature of the mask and solder reflow temperature, is added to the microstrip mask 100 used for a mask arranging step. COPYRIGHT: (C)2010,JPO&INPIT