LIGHT EMITTING MEMBER, LIGHT EMITTING DEVICE, ELECTRONIC DEVICE, MECHANICAL DEVICE, METHOD OF MANUFACTURING THE LIGHT EMITTING MEMBER, AND METHOD OF MANUFACTURING THE LIGHT EMITTING DEVICE

LIGHT EMITTING MEMBER, LIGHT EMITTING DEVICE, ELECTRONIC DEVICE, MECHANICAL DEVICE, METHOD OF MANUFACTURING THE LIGHT EMITTING MEMBER, AND METHOD OF MANUFACTURING THE LIGHT EMITTING DEVICE

PROBLEM TO BE SOLVED: To suppress an increase in a temperature of a light emitting diode when the light emitting diode is fixed by using a low heat conductive material in a light emitting member. SOLUTION: The light emitting member includes a blue LED 66, and a second lead part 63 for supporting the...

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Bibliographische Detailangaben
1. Verfasser: MIKI HISAYUKI
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Zusammenfassung:PROBLEM TO BE SOLVED: To suppress an increase in a temperature of a light emitting diode when the light emitting diode is fixed by using a low heat conductive material in a light emitting member. SOLUTION: The light emitting member includes a blue LED 66, and a second lead part 63 for supporting the blue LED 66. The second lead part 63 includes groove parts 65a, 65b in which adhesive are injected, and a projection part which is in direct contact with the blue LED 66, in a support region for supporting the blue LED 66. COPYRIGHT: (C)2010,JPO&INPIT