PHOTO-CURABLE RESIN COMPOSITION

PROBLEM TO BE SOLVED: To provide a photo-curable resin composition which gives a cured product having a low dielectric constant and a low dielectric loss (low dielectric tangent) and is applicable even to high-frequency electronic parts. SOLUTION: The photo-curable resin composition comprises a poly...

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Hauptverfasser:	HOJO TAKUMA, KOTO TAKEAKI, ATSUMI KAZUHIKO, YAMAMOTO KYOKO
Format:	Patent
Sprache:	eng
Schlagworte:	CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a photo-curable resin composition which gives a cured product having a low dielectric constant and a low dielectric loss (low dielectric tangent) and is applicable even to high-frequency electronic parts. SOLUTION: The photo-curable resin composition comprises a polymer or a copolymer containing a constitutional unit expressed by formula [I] (wherein, m is 0 or 1) and a polythiol compound having not less than two thiol groups in the molecule. COPYRIGHT: (C)2010,JPO&INPIT