SUBSTRATE PROCESSING APPARATUS

PROBLEM TO BE SOLVED: To provide a substrate processing apparatus, that shortens an operation time, mitigates the burden on a worker and further reduces the risk of damage to the gas nozzle, by facilitating the replacement of a gas nozzle. SOLUTION: The substrate processing apparatus includes a proc...

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1. Verfasser: TAKEBAYASHI MOTONARI
Format: Patent
Sprache:eng
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Zusammenfassung:PROBLEM TO BE SOLVED: To provide a substrate processing apparatus, that shortens an operation time, mitigates the burden on a worker and further reduces the risk of damage to the gas nozzle, by facilitating the replacement of a gas nozzle. SOLUTION: The substrate processing apparatus includes a processing chamber 1 which stores a substrate 7, a load lock chamber 4 coupled airtightly below the processing chamber, and the gas nozzle 11 stood in the processing chamber to supply a processing gas. A gas nozzle holding hole which is open to the processing chamber is formed vertically in a top plate portion 4a of the load lock chamber, the gas nozzle is inserted into the gas nozzle holding hole from below, and a lower end of the gas nozzle is held airtightly by the gas nozzle holding hole for the processing chamber and load lock chamber. A communication hole is bored in the lower end of the gas nozzle, and a gas flow passage 19 connected to a gas supply source is formed on the top plate portion and communicates with the gas nozzle through the communication hole. COPYRIGHT: (C)2010,JPO&INPIT