FUNCTIONAL ELECTROCONDUCTIVE COATING AND METHOD FOR PRODUCTION OF PRINTED CIRCUIT BOARD USING THE SAME

PROBLEM TO BE SOLVED: To provide a low temperature-curable functional electroconductive coating that exhibits high adhesion to a resin substrate or copper foil and good electroconductivity and can be strongly soldered, and to provide a method for production of a printed circuit board using the same....

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Hauptverfasser: YANO KATSUMI, YOSHIDA SHINOBU, IKEHATA YOSHIO, FUJISHIRO TOSHIFUMI, YOKOYAMA YOSHIYUKI, YAMAMICHI YUJI
Format: Patent
Sprache:eng
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Zusammenfassung:PROBLEM TO BE SOLVED: To provide a low temperature-curable functional electroconductive coating that exhibits high adhesion to a resin substrate or copper foil and good electroconductivity and can be strongly soldered, and to provide a method for production of a printed circuit board using the same. SOLUTION: The functional electroconductive coating comprises phthalocyanine and/or a phthalocyanine complex, a metal powder and a thermosetting resin. The metal powder is an Ag-coated Ni powder and/or an Ag powder. The phthalocyanine complex is Ag phthalocyanine. In the functional electroconductive coating, an unsaturated fatty acid is blended. The unsaturated fatty acid is oleic acid while the thermosetting resin is a resol-type phenolic resin. COPYRIGHT: (C)2010,JPO&INPIT