RESIN MOLDING METHOD AND RESIN MOLDING APPARATUS OF CIRCULATING MOLDED ARTICLE

PROBLEM TO BE SOLVED: To effectively carry out two-color molding etc. of a code equipped with a terminal and other molded articles at low cost without enlarging or complicating an apparatus. SOLUTION: A plurality of molding frames 2 where molded articles are transversely placed are transported one b...

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1. Verfasser: TAKAI KAZUO
Format: Patent
Sprache:eng
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Zusammenfassung:PROBLEM TO BE SOLVED: To effectively carry out two-color molding etc. of a code equipped with a terminal and other molded articles at low cost without enlarging or complicating an apparatus. SOLUTION: A plurality of molding frames 2 where molded articles are transversely placed are transported one by one by a circuit 5, and the molding frames 2 are positioned within a pair of upper and down dies 6 equipped in the circuit 5, whereby the peripheral part of the molded article 1 is molded from a resin by the dies 6, and then the molded article 1 is transported to a discharge position, where the molded article 1 is taken out of the molding frame 2. The circuit 5 is formed in a square frame shape from side view, and a plurality of pairs of upper and down dies 6 are continuously set in the circuit 5. The molding frames 2 are transported one by one to the positions of the dies 6, and after the molding frames 2 are positioned within the molding dies 6, the dies is closed and the resin is introduced therein. The peripheral part of the molded article 1 is primarily molded with the first molding die 6, and then the second molding is conducted secondarily by the next molding die 6, and repeating the above according to the number of the molding dies 6. COPYRIGHT: (C)2010,JPO&INPIT