DEVICE FOR INTERCONNECTING JOINING PADS IN HEAD GIMBALS ASSEMBLY AND METHOD FOR MANUFACTURING HEAD GIMBALS ASSEMBLY

PROBLEM TO BE SOLVED: To improve the productivity of a head gimbals assembly. SOLUTION: A soldering device for interconnecting the joining pads for a head slider and gimbals has a nozzle 21 at a position near the head slider. The nozzle has a receiving section 214 which receives a solder ball 32 con...

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Bibliographische Detailangaben
Hauptverfasser:	OSAWA HIDENORI, TSUCHIYA TATSUMI, YOSHIDA TATSUSHI, MATSUMOTO YUSUKE
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACHINE TOOLS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS PRINTED CIRCUITS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To improve the productivity of a head gimbals assembly. SOLUTION: A soldering device for interconnecting the joining pads for a head slider and gimbals has a nozzle 21 at a position near the head slider. The nozzle has a receiving section 214 which receives a solder ball 32 conveyed by inert gas, and a straight guide section 213 which is smaller than the receiving section in inner diameter. The solder ball is melt by irradiation with a laser beam from the inflow side of the nozzle when and/or after the solder ball passes through the straight guide section. The melt solder ball adheres to the joining pads, and then solidifies so that the joining pads are interconnected. COPYRIGHT: (C)2010,JPO&INPIT