METHOD FOR PRODUCING SEMICONDUCTOR SUBSTRATE AND SEMICONDUCTOR SUBSTRATE OBTAINED THEREBY

PROBLEM TO BE SOLVED: To provide a method for efficiently producing a semiconductor substrate in which a smooth semiconductor layer is formed by baking a printed layer containing copper nano-particles disposed on a base material at a low temperature for a short time. SOLUTION: The method for produci...

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1. Verfasser: HOJO MIKIKO
Format: Patent
Sprache:eng
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Zusammenfassung:PROBLEM TO BE SOLVED: To provide a method for efficiently producing a semiconductor substrate in which a smooth semiconductor layer is formed by baking a printed layer containing copper nano-particles disposed on a base material at a low temperature for a short time. SOLUTION: The method for producing the semiconductor substrate includes a step of forming the printed layer by printing a pattern with a coating solution containing copper nano-particles and then a step of forming the pattern of the semiconductor layer by baking the printed layer, wherein the printed layer is baked by exposing the printed layer to the surface-wave plasma generated by an application of a microwave energy under an atmosphere containing oxygen. COPYRIGHT: (C)2010,JPO&INPIT