METHOD FOR PRODUCING SEMICONDUCTOR SUBSTRATE AND SEMICONDUCTOR SUBSTRATE OBTAINED THEREBY
PROBLEM TO BE SOLVED: To provide a method for efficiently producing a semiconductor substrate in which a smooth semiconductor layer is formed by baking a printed layer containing copper nano-particles disposed on a base material at a low temperature for a short time. SOLUTION: The method for produci...
Gespeichert in:
1. Verfasser: | |
---|---|
Format: | Patent |
Sprache: | eng |
Schlagworte: | |
Online-Zugang: | Volltext bestellen |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
Zusammenfassung: | PROBLEM TO BE SOLVED: To provide a method for efficiently producing a semiconductor substrate in which a smooth semiconductor layer is formed by baking a printed layer containing copper nano-particles disposed on a base material at a low temperature for a short time. SOLUTION: The method for producing the semiconductor substrate includes a step of forming the printed layer by printing a pattern with a coating solution containing copper nano-particles and then a step of forming the pattern of the semiconductor layer by baking the printed layer, wherein the printed layer is baked by exposing the printed layer to the surface-wave plasma generated by an application of a microwave energy under an atmosphere containing oxygen. COPYRIGHT: (C)2010,JPO&INPIT |
---|