SEMICONDUCTOR MODULE, METHOD FOR MANUFACTURING THE SEMICONDUCTOR MODULE, AND MOBILE APPARATUS

PROBLEM TO BE SOLVED: To improve reliability in connections between bump electrodes and element electrodes in a semiconductor module having a structure such that the bump electrodes provided integrally with a wiring layer are connected to the element electrodes provided in a semiconductor element. S...

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Hauptverfasser: SAITO KOICHI, NAKAZATO MAYUMI
Format: Patent
Sprache:eng
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Zusammenfassung:PROBLEM TO BE SOLVED: To improve reliability in connections between bump electrodes and element electrodes in a semiconductor module having a structure such that the bump electrodes provided integrally with a wiring layer are connected to the element electrodes provided in a semiconductor element. SOLUTION: An insulating resin layer 40 is provided between a semiconductor element 20 and a wiring layer 50. Bump electrodes 60 integrally formed with the wiring layer 50 and protruding from the wiring layer 50 toward the insulating resin layer 40 are electrically connected to the element electrodes provided in the semiconductor element 20. The wiring layer 50 in a wiring region 54 is recessedly formed closer toward the semiconductor element 20 than the wiring layer 50 in a protruding area 52. Further, the wiring layer 50 in the wiring region 54 is partially buried in the insulating resin layer 40, and an interface between the insulating resin layer 40 and a protective layer 70 is positioned in at least a part of a side face of the wiring layer 50 in the wiring region 54. COPYRIGHT: (C)2010,JPO&INPIT