CIRCUIT DEVICE

PROBLEM TO BE SOLVED: To provide a circuit device in which thermal interference between built-in elements is suppressed while the size as the entire device is reduced. SOLUTION: A hybrid integrated circuit device 10 includes a circuit board 12 in which a hybrid integrated circuit made of a semiconductor element 28A and the like and bonded to a heat spreader 30A is built in an upper surface, a sealing resin 44 for sealing the hybrid integrated circuit by covering the circuit board 12, and a lead 14 which is bonded to a pad of a conductive pattern 20 and extended outside. The position of the semiconductor element 28A mounted on the heat spreader 30A is different from the position of a semiconductor element 28B mounted on a heat spreader 30B, to separate them from each other. COPYRIGHT: (C)2010,JPO&INPIT