FILM DEPOSITION METHOD OF LEAD-CONTAINING PEROVSKITE-TYPE OXIDE FILM, PIEZOELECTRIC DEVICE, AND LIQUID EJECTING DEVICE

PROBLEM TO BE SOLVED: To provide a film deposition method capable of easily depositing a lead-containing perovskite-type oxide film of (100) orientation and/or (001) orientation without changing any film deposition material or adding forming of a base film, and to provide a piezoelectric device, and...

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Bibliographische Detailangaben
1. Verfasser:	SHINKAWA TAKAMI
Format:	Patent
Sprache:	eng
Schlagworte:	CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL CORRECTION OF TYPOGRAPHICAL ERRORS DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRICITY i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL LINING MACHINES METALLURGY PERFORMING OPERATIONS PRINTING SELECTIVE PRINTING MECHANISMS STAMPS SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION TRANSPORTING TYPEWRITERS
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a film deposition method capable of easily depositing a lead-containing perovskite-type oxide film of (100) orientation and/or (001) orientation without changing any film deposition material or adding forming of a base film, and to provide a piezoelectric device, and a liquid ejecting device. SOLUTION: When depositing the lead-containing perovskite-type oxide film having the crystalline orientation of (100) and/or (001) orientation and mainly composed of lead, in the initial stage of the film deposition, the oxide film is deposited under the initial film deposition condition that the quantity of lead indicating the molar ratio of lead to cations other than lead out of cations contained in the oxide film becomes excessive, and thereafter, the oxide film is deposited under the basic film deposition condition that the quantity of lead is less than that in the initial film deposition condition. COPYRIGHT: (C)2010,JPO&INPIT