APPARATUS FOR MOUNTING ELECTRONIC COMPONENT, AND IMAGE READ METHOD THEREIN

PROBLEM TO BE SOLVED: To provide an apparatus for mounting an electronic component that can shorten a necessary time for image reading and improve a cycle time of a component mounting operation, and to provide an image read method in the apparatus for mounting electronic component. SOLUTION: In the...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: TSUTSUMI TAKUYA, HATASE TAKAYUKI
Format: Patent
Sprache:eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To provide an apparatus for mounting an electronic component that can shorten a necessary time for image reading and improve a cycle time of a component mounting operation, and to provide an image read method in the apparatus for mounting electronic component. SOLUTION: In the apparatus for mounting the electronic component having component mounting mechanisms arranged on both sides of a substrate conveying mechanism 2, a first image read unit 6A and a second image read unit 6B operative to read images of electronic components held on mounting heads 14A and 14B from below are configured to read the images through either of a first-direction scanning operation and a second-direction scanning operation for reading images by moving the mounting heads corresponding to the image read units in an X direction as a substrate conveying direction and a Y direction orthogonal to the X direction respectively. Consequently, the first-direction scanning operation or second-direction scanning operation which has smaller cycle time loss is selected for the component mounting operation. COPYRIGHT: (C)2010,JPO&INPIT