DEVICE AND METHOD FOR PROCESSING SUBSTRATE

PROBLEM TO BE SOLVED: To provide a device and method for processing a substrate, improving a substrate holding force, wherein predetermined processing is carried out to a substrate held by being pushed to a supporting member while the substrate is supported in an approximately horizontal posture by abutting a top end portion of the supporting member on a lower surface of the substrate. SOLUTION: A first holding mode and a second holding mode are provided as holding modes of a substrate W. In the first holding mode, the substrate W is only pushed toward the supporting pin PN with a pushing force Fa by supplying a nitrogen gas to a front surface Wf of the substrate while supporting a back surface Wb of the substrate with a supporting pin PN. In the second holding mode, however, a suction force Fb is applied to the substrate W from the back surface Wb of the substrate in addition to the pushing force Fa. Thus, a holding force of the substrate W is improved by the added suction force Fb, the substrate W is stably held when rotating the substrate W at a high speed, and, as a result, substrate processing is properly carried out. COPYRIGHT: (C)2010,JPO&INPIT