PREBAKE METHOD AND PREBAKE APPARATUS

PROBLEM TO BE SOLVED: To provide a prebake method that can achieve in-plane uniformity of a thickness of a resin film and can shorten an exhaustion time period after a substrate is carried when a workpiece is subjected to prebaking, wherein the workpiece has the resin film formed by applying an appl...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: KOBASHI YASUHIRO, AWAKAWA HIDEO, KAI TOMOHIRO
Format: Patent
Sprache:eng
Schlagworte:
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