TRANSFER FILM FOR FORMING METAL PATTERN, AND METAL PATTERN FORMING METHOD

PROBLEM TO BE SOLVED: To provide a method of forming a metal pattern of excellent linearity, and a transfer film usable in the method. SOLUTION: This transfer film for forming the metallic pattern is laminated with (A) a resist layer, (B) a metal foil layer formed by rolling, and (C) a pressure-sens...

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Bibliographische Detailangaben
Hauptverfasser: KAWAGISHI SEIJI, KUWATA HIROAKI, SAWADA KATSUTOSHI, YAMASHITA TAKANORI
Format: Patent
Sprache:eng
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Zusammenfassung:PROBLEM TO BE SOLVED: To provide a method of forming a metal pattern of excellent linearity, and a transfer film usable in the method. SOLUTION: This transfer film for forming the metallic pattern is laminated with (A) a resist layer, (B) a metal foil layer formed by rolling, and (C) a pressure-sensitive adhesive layer in this order on a support film, and is constituted to make a flow direction of the resist layer (A) at the forming time substantially in parallel to an rolling direction of the metal foil layer (B). COPYRIGHT: (C)2010,JPO&INPIT