HEAT SINK FOR LED, HEAT SINK PRECURSOR FOR LED, LED ELEMENT, METHOD FOR MANUFACTURING HEAT SINK FOR LED AND METHOD FOR MANUFACTURING LED ELEMENT

PROBLEM TO BE SOLVED: To provide a heat sink for LED capable of reducing material cost and also improving processability, a heat sink precursor for an LED which becomes a precursor of the heat sink for the LED, an LED element using the heat sink for the LED, a method for manufacturing the heat sink...

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Hauptverfasser:	YAMAGATA SHINICHI, ABE YUGAKU, MASHIMA MASATOSHI, SUWATA OSAMU, INASAWA SHINJI, YOKOYAMA HIROSHI, NITTA KOJI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a heat sink for LED capable of reducing material cost and also improving processability, a heat sink precursor for an LED which becomes a precursor of the heat sink for the LED, an LED element using the heat sink for the LED, a method for manufacturing the heat sink for the LED and a method for manufacturing the LED element. SOLUTION: The are provided the heat sink for LED which is composed of laminated structure including a high thermal conductivity layer and a low thermal conductivity layer, wherein the whole thickness is ≤0.1 mm, the heat sink precursor for the LED which becomes the precursor of the heat sink for LED, the LED element which uses the heat sink for the LED, a method for manufacturing the heat sink for the LED and a method for manufacturing the LED element. COPYRIGHT: (C)2010,JPO&INPIT