SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To provide a small semiconductor device where electric resistance by conductor wiring is reduced. SOLUTION: The semiconductor device includes a semiconductor element 106 and a support 101 having a recess in which the semiconductor element 106 is arranged. The support 101 includes an insulating substrate, a pair of positive and negative electrode terminals 102d and 103d on a side of the insulating substrate, a pair of positive and negative conductor wirings 102a and 103a connected to the electrode terminals and an electrode of the semiconductor element 106, and a metal member 104 arranged on a side of the recess. A pair of positive and negative conductor wirings embedded in the insulating substrate includes wiring inside through hole 102b, which is extended in a thickness direction, and wiring outside through hole 103b, which is extended in a direction parallel to a main face. One conductor wiring 102a in a pair of positive and negative conductor wirings arranged at a base of the recess is connected to one electrode terminal 102d via wiring inside through hole 102b. The other conductor wiring 103a is connected to the other electrode terminal 103d via wiring outside through hole 103b. COPYRIGHT: (C)2010,JPO&INPIT