MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To provide a manufacturing method of a semiconductor device for enhancing the efficiency of manufacturing a semiconductor device laminated with a plurality of semiconductor chips. SOLUTION: This manufacturing method of a semiconductor device has a process for preparing a plurality of memory chips (semiconductor chips) each having a main face having four sides at the periphery thereof, a rear face positioned opposite to the main face, side faces positioned between the main face and the rear face, and a plurality of pads formed along one side among four sides which the main face has, and serially laminating the plurality of memory chips along a first direction crossing an array direction of the plurality of pads while offsetting positions of the side faces of the plurality of memory chips in which the process for laminating the memory chips includes a process in which an image processing apparatus obtains image data of a memory chip mounted region (chip mounted region) and a process in which the image processing apparatus determines the presence or absence of a memory chip already mounted in the memory chip mounting region by comparing the image data with image data for comparison that has been registered beforehand. COPYRIGHT: (C)2010,JPO&INPIT