DICING/DIE BONDING TAPE AND METHOD FOR MANUFACTURING SEMICONDUCTOR CHIP

PROBLEM TO BE SOLVED: To provide a dicing/die bonding tape cutting a die bonding film with high precision by laser dicing and easily peeling a semiconductor chip together with the die bonding film after laser dicing. SOLUTION: The dicing/die bonding tape 1 for laser dicing includes a die bonding fil...

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Bibliographische Detailangaben
Hauptverfasser:	NOZATO SEIJI, FUKUOKA MASATERU
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES BASIC ELECTRIC ELEMENTS CHEMISTRY DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS POLISHES SEMICONDUCTOR DEVICES USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a dicing/die bonding tape cutting a die bonding film with high precision by laser dicing and easily peeling a semiconductor chip together with the die bonding film after laser dicing. SOLUTION: The dicing/die bonding tape 1 for laser dicing includes a die bonding film 3 and a non-adhesive film 4 stuck to one surface of the die bonding film 3. The die bonding film 3 includes a thermosetting compound and a thermosetting agent. The non-adhesive film 4 includes a crosslinked product of a (meth)acrylic resin composition as a main component and has a gel fraction of 60-100%. COPYRIGHT: (C)2010,JPO&INPIT