METHOD OF AND DEVICE FOR POLISHING SURFACE OF SUBSTRATE-PLACING PLATE FOR SUBSTRATE-PLACING DEVICE

PROBLEM TO BE SOLVED: To provide a method of and a device for mirror-polishing a surface of a substrate (chuck)-placing plate for a substrate-placing device having projections on its surface especially capable of polishing side surfaces of the projections and the surface of the chuck covered with th...

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Bibliographische Detailangaben
1. Verfasser:	KOMATSU KATSUHIKO
Format:	Patent
Sprache:	eng
Schlagworte:	DRESSING OR CONDITIONING OF ABRADING SURFACES FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING TRANSPORTING
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a method of and a device for mirror-polishing a surface of a substrate (chuck)-placing plate for a substrate-placing device having projections on its surface especially capable of polishing side surfaces of the projections and the surface of the chuck covered with the projections efficiently and excellently in polishing precision. SOLUTION: The method includes mirror-polishing the surface of the substrate-placing plate having the projections by placing a slurry type abrasive mixed with magnetic grains and abrasive grains in a lubricant on the surface of the substrate-placing plate and moving the abrasive on the surface of the plate by placing a magnetic force generator on the back surface side of the plate and moving the magnetic force generator. The device for placing the substrate places and moves a wafer for a semiconductor and a wafer for liquid crystal, and the substrate-placing plate is made of fine ceramics. COPYRIGHT: (C)2010,JPO&INPIT