METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND WAFER FOR FORMING SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To provide a method of manufacturing a semiconductor device for easily identifying confirming and non-confirming articles in a packaging process, such as a die bonding process, and to provide a wafer. SOLUTION: A resist film is formed so that at least an outer-periphery section is exposed in the wafer 1 having a circuit element formed on a surface, and mixed acid is used for etching process, thus making at least the surface porous in a chip 3a at the outer-periphery side in a nonconforming chip region of the wafer 1 to form a region having reflectance lower than that of the surface of a chip 3b inside the wafer. There is also a method of forming a plating layer as the region having low reflectance in addition to the method. COPYRIGHT: (C)2010,JPO&INPIT